|
BOND TYPE
|
BOND SYSTEM
|
ATTRIBUTES
|
|
Resin Bonds
|
B100
|
General purpose phenolic resin bond Applications: General purpose wet grinding with diamond or CBN |
|
B110
|
Dry grinding phenolic resin bond Applications: Dry grinding carbide |
|
|
B120
|
Centerless and high contact area phenolic resin grinding
bond Applications: Centerless or high contact area grinding |
|
|
B200
|
Free-cutting phenolic resin bond Applications: Very free cutting grinding with fine grit sizes |
|
|
B210
|
Dry lubricant phenolic resin bond Applications: 11V9 cup wheels, tool sharpening |
|
|
Polyimide Resin Bonds
|
H400
|
Polyimide resin bond Applications: Carbide insert periphery grinding |
|
P500
|
Polyimide resin bond Applications: Blanchard grinding, creep feed grinding |
|
|
Metal Bonds
|
M180
|
Free-cutting crushable metal bond Applications: Crushable form grinding, difficult to grind ceramics |
|
M250
|
Soft metal bond for high contact area grinding Applications: Blanchard grinding of ceramic and glass materials |
|
|
M400
|
Bronze bond specifically for fine grit form holding (325
grit or finer) Applications: Corner holding and form retention on fine grit diamond |
|
|
M500
|
Bronze bond for ceramics and glass (up to 18" OD on
1A1 and 1A1R) Applications: Blanchard, surface, and cut-off grinding operations |
|
|
Electroplated Bonds
|
E
|
Standard plating process Applications: All electroplated diamond and CBN grinding wheels |
|
E40
|
Plating process with less nickel coverage for greater abrasive
exposure Applications: Nickel-based aerospace alloy creepfeed grinding |
|
|
EHT
|
Precision plating process for tight-tolerance, fine grit
size forms Applications: Thread form generating wheels |
